The corpus · Laser Materials Processing

Kinetically limited nano-scale diffusion bond structures and methods

US12454117B2 · filed 2021-03-15 · granted 2025-10-28 · Medtronic, Inc.; Corning Incorporated notable

Why it ranks where it does

Diffusion-bond line's 2025 form.

Signals: 3-grant family chain · co-assigned with Corning · see methodology.

Inventors

Michael S. Sandlin, David A. Ruben, Raymond M. Karam, Georges Roussos, Thomas M. Wynne

Same line

Read the full patent on Google Patents → (claims, figures, citations — all public domain)