The corpus

56 granted patents, 1996–2026

Every grant, in order. Tier reflects the transparent ranking (how it's computed): flagships anchor a line; supporting entries extend one.

GrantedPatentThemeTier
1996 Implantable medical device including a first enclosure portion having a feedthrough in a second interior surface
US5535097A
Hermetic Packaging & Feedthroughs flagship
1999 Shock resistant accelerometer for implantable medical device
US5885471A
Implantable Sensors flagship
1999 High output sensor and accelerometer implantable medical device
US5911738A
Implantable Sensors notable
2000 High output sensor and accelerometer for implantable medical device
US6038475A
Implantable Sensors notable
2001 Accelerometer for implantable medical device
US6216537B1
Implantable Sensors flagship
2002 Apparatus and method for laser welding of ribbons
US6501043B1 · sole inventor
Laser Materials Processing flagship
2004 Apparatus and method for laser welding of ribbons
US6717100B2 · sole inventor
Laser Materials Processing notable
2004 Freeform substrates and devices
US6787891B2 · sole inventor
Interconnects & Materials major
2005 Implantable medical device including a surface-mount terminal array
US6963780B2
Interconnects & Materials flagship
2007 Assembly including a circuit and an encapsulation frame, and method of making the same
US7288847B2
Hermetic Packaging & Feedthroughs notable
2008 Freeform substrates and devices
US7335530B2 · sole inventor
Interconnects & Materials notable
2009 Pressure sensor configurations for implantable medical electrical leads
US7591185B1
Implantable Sensors notable
2010 Encapsulation circuitry on a substrate
US7682878B2
Hermetic Packaging & Feedthroughs notable
2011 Laser bonding tool with improved bonding accuracy
US7872208B2
Laser Materials Processing notable
2011 Pressure sensor configurations for implantable medical electrical leads
US7886608B2
Implantable Sensors notable
2011 Hermeticity testing
US7902851B2
Hermetic Packaging & Feedthroughs major
2012 Metallization with tailorable coefficient of thermal expansion
US8141556B2 · sole inventor
Interconnects & Materials major
2013 Implantable capacitive pressure sensor apparatus and methods regarding same
US8424388B2
Implantable Sensors major
2013 Layered structure for corrosion resistant interconnect contacts
US8461681B2 · sole inventor
Interconnects & Materials major
2014 Wafer-scale package including power source
US8666505B2
Power Sources flagship
2014 Techniques for bonding substrates using an intermediate layer
US8796109B2
Laser Materials Processing major
2015 Laser assisted direct bonding
US9171721B2
Laser Materials Processing major
2016 Power sources suitable for use in implantable medical devices and corresponding fabrication methods
US9252415B2
Power Sources major
2016 Wafer-scale package including power source
US9318400B2
Power Sources flagship
2017 Media-exposed interconnects for transducers
US9616223B2
Implantable Sensors notable
2017 Embedded metallic structures in glass
US9832867B2
Hermetic Packaging & Feedthroughs notable
2018 Feedthrough assemblies (parent of the laser-bond feedthrough line)
US9865533B2
Hermetic Packaging & Feedthroughs flagship
2018 Error correction techniques in surgical navigation
US9913693B2
Flow Control & Surgical Navigation major
2018 Nuclear radiation particle power converter
US10096393B2
Power Sources flagship
2018 Kinetically limited nano-scale diffusion bond structures and methods
US10124559B2
Laser Materials Processing flagship
2019 Sealed package and method of forming same
US10420509B2
Hermetic Packaging & Feedthroughs supporting
2019 Hermetic conductive feedthroughs for a semiconductor wafer
US10464836B2
Hermetic Packaging & Feedthroughs notable
2020 Feedthrough assemblies and methods of forming same
US10535596B2
Hermetic Packaging & Feedthroughs flagship
2020 Sealed package and method of forming same
US10765372B2
Hermetic Packaging & Feedthroughs supporting
2020 Nuclear radiation particle power converter
US10811157B2
Power Sources supporting
2020 Hermetically-sealed packages including feedthrough assemblies
US10813238B2 · sole inventor
Hermetic Packaging & Feedthroughs major
2020 Power source and method of forming same (radioluminescent: radioactive to light to photovoltaic)
US10818811B2
Power Sources major
2021 Kinetically limited nano-scale diffusion bond structures and methods
US10981355B2
Laser Materials Processing supporting
2021 Sealed implantable medical device and method of forming same
US11103714B2
Hermetic Packaging & Feedthroughs notable
2021 Power source and method of forming same
US11189390B2
Power Sources notable
2022 Sealed package and method of forming same
US11419552B2
Hermetic Packaging & Feedthroughs supporting
2022 Hermetic conductive feedthroughs for a semiconductor wafer
US11485670B2
Hermetic Packaging & Feedthroughs notable
2023 Surface texturing using energy pulses
US11548092B2
Laser Materials Processing notable
2023 System and method for valve control
US11701503B2
Flow Control & Surgical Navigation flagship
2023 Pressure sensor assembly for use in implantable medical device (substrate with via along via axis)
US11725995B2
Implantable Sensors notable
2023 Sealed package and method of forming same
US11744518B2
Hermetic Packaging & Feedthroughs major
2024 Hermetic assembly and device including same
US11865639B2
Hermetic Packaging & Feedthroughs supporting
2024 Nuclear radiation particle power converter
US11881325B2
Power Sources major
2024 Methods for forming hermetically-sealed packages including feedthrough assemblies
US11950387B2 · sole inventor
Hermetic Packaging & Feedthroughs major
2024 Surface texturing using energy pulses
US11969821B2
Laser Materials Processing supporting
2024 Laser cutting system
US11999014B2
Laser Materials Processing notable
2024 System and method for valve control
US12059542B2
Flow Control & Surgical Navigation notable
2024 Electronic package and device including same
US12082354B2
Hermetic Packaging & Feedthroughs notable
2025 Hermetic assembly and device including same
US12233477B2
Hermetic Packaging & Feedthroughs notable
2025 Kinetically limited nano-scale diffusion bond structures and methods
US12454117B2
Laser Materials Processing notable
2026 Sealed package including electronic device and power source
US12610487B2
Hermetic Packaging & Feedthroughs notable

Pending applications

Published, not yet granted — the visible edge of the pipeline.

PublishedApplicationTheme
2026 Swabbable valve with universal proximal connector
US20260102554A1 — NEEDS REVIEW (updated 2026-07-22): assignee is Darco International Inc, NOT Medtronic. Inventors David A. Ruben + Alexander J. Ruben. Could be a post/parallel-Medtronic family venture — or a different David A. Ruben. Do not count in the Medtronic corpus; confirm with David directly.
Flow Control & Surgical Navigation
2025 Stackable multi-electrode sensor array providing modularity in making multianalyte sensing devices
US20250288227A1 — CONFIRMED 2026-07-22: assignee Medtronic MiniMed. A 'basic metabolic panel' sensor — glucose, ketones, potassium, creatinine, sodium, BUN — stacked so incompatible fabrication steps can't destroy each other's enzymes.
Implantable Sensors
2025 Electrical component and method of forming same (corrosion-resistant vias in ceramic/sapphire)
US20250070009A1
Hermetic Packaging & Feedthroughs
2025 Electrical component and method of forming same (gold-alloy via)
US20250070008A1
Hermetic Packaging & Feedthroughs
2025 Enclosures with hermetic feedthroughs
US20250065135A1
Hermetic Packaging & Feedthroughs
2024 System and method for valve control
US20240382723A1
Flow Control & Surgical Navigation
2024 Hermetically-sealed packages including feedthrough assemblies
US20240244782A1
Hermetic Packaging & Feedthroughs
2023 Noise reduction for sensor apparatus
US20230314340A1 — Analyte biosensor signal processing.
Implantable Sensors