The corpus · Hermetic Packaging & Feedthroughs

Embedded metallic structures in glass

US9832867B2 · filed 2015-11-23 · granted 2017-11-28 · Medtronic, Inc. notable

Why it ranks where it does

3D routing + antennas inside glass walls; 4 of 5 visible citations from Samtec (interconnect industry).

Signals: see methodology.

Inventors

John K. Day, David A. Ruben, Michael S. Sandlin

Read the full patent on Google Patents → (claims, figures, citations — all public domain)