The corpus · Hermetic Packaging & Feedthroughs
Embedded metallic structures in glass
US9832867B2 · filed 2015-11-23 · granted 2017-11-28 · Medtronic, Inc. notable
Why it ranks where it does
3D routing + antennas inside glass walls; 4 of 5 visible citations from Samtec (interconnect industry).
Signals: see methodology.
Inventors
John K. Day, David A. Ruben, Michael S. Sandlin
Read the full patent on Google Patents → (claims, figures, citations — all public domain)