Hermetic Packaging & Feedthroughs

An implantable device is a promise: nothing leaks in, nothing leaks out, for a decade or more, in warm salt water. This cluster is thirty years of keeping that promise — from the 1993 housing that let a pacemaker be assembled like a microchip, to laser-bonded feedthroughs that pass signals through sapphire walls with nanometer-scale seals, to testing structures that prove the seal is real (US7902851). If the corpus has a thesis statement, it is here. T3 · interpretation

Deep dives: first housing · hermetic feedthrough line

20 granted patents in this theme

Granted	Patent
1996	Implantable medical device including a first enclosure portion having a feedthrough in a second interior surface US5535097A
2007	Assembly including a circuit and an encapsulation frame, and method of making the same US7288847B2
2010	Encapsulation circuitry on a substrate US7682878B2
2011	Hermeticity testing US7902851B2
2017	Embedded metallic structures in glass US9832867B2
2018	Feedthrough assemblies (parent of the laser-bond feedthrough line) US9865533B2
2019	Sealed package and method of forming same US10420509B2
2019	Hermetic conductive feedthroughs for a semiconductor wafer US10464836B2
2020	Feedthrough assemblies and methods of forming same US10535596B2
2020	Sealed package and method of forming same US10765372B2
2020	Hermetically-sealed packages including feedthrough assemblies US10813238B2 · sole inventor
2021	Sealed implantable medical device and method of forming same US11103714B2
2022	Sealed package and method of forming same US11419552B2
2022	Hermetic conductive feedthroughs for a semiconductor wafer US11485670B2
2023	Sealed package and method of forming same US11744518B2
2024	Hermetic assembly and device including same US11865639B2
2024	Methods for forming hermetically-sealed packages including feedthrough assemblies US11950387B2 · sole inventor
2024	Electronic package and device including same US12082354B2
2025	Hermetic assembly and device including same US12233477B2
2026	Sealed package including electronic device and power source US12610487B2

Pending in this theme

Electrical component and method of forming same (corrosion-resistant vias in ceramic/sapphire) (US20250070009A1)
Electrical component and method of forming same (gold-alloy via) (US20250070008A1)
Enclosures with hermetic feedthroughs (US20250065135A1)
Hermetically-sealed packages including feedthrough assemblies (US20240244782A1)