The corpus · Hermetic Packaging & Feedthroughs
Methods for forming hermetically-sealed packages including feedthrough assemblies
US11950387B2 · filed 2020-10-19 · granted 2024-04-02 · Medtronic, Inc. major
Why it ranks where it does
Sole-inventor methods grant extending the feedthrough line into 2024.
Signals: sole inventor · 4-grant family chain · see methodology.
Inventors
David A. Ruben
Same line
- US10813238B2 — Hermetically-sealed packages including feedthrough assemblies (2020)
- US9865533B2 — Feedthrough assemblies (parent of the laser-bond feedthrough line) (2018)
- US10535596B2 — Feedthrough assemblies and methods of forming same (2020)
Read the full patent on Google Patents → (claims, figures, citations — all public domain)