The corpus · Hermetic Packaging & Feedthroughs
Feedthrough assemblies (parent of the laser-bond feedthrough line)
US9865533B2 · filed 2015-12-11 · granted 2018-01-09 · Medtronic, Inc. flagship
Why it ranks where it does
Founds the laser-bond feedthrough line (priority 2014-12-24).
Signals: founds its line · 4-grant family chain · see methodology.
Inventors
David A. Ruben, Michael S. Sandlin
Same line
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Read the full patent on Google Patents → (claims, figures, citations — all public domain)