Feedthrough assemblies and methods of forming same

Abstract T1 · from the patent

Various embodiments of a feedthrough assembly are disclosed. The feedthrough assembly can include a non-conductive substrate and a feedthrough comprising a via from an outer surface to an inner surface, a conductive material in the via, and an external contact over the via on the outer surface, electrically coupled to the conductive material. The external contact is hermetically sealed to the outer surface by a bond — in one or more embodiments, a laser bond — surrounding the via.

Why it ranks where it does

Core articulation of the laser-bond feedthrough claim.

Signals: 4-grant family chain · see methodology.