The corpus · Hermetic Packaging & Feedthroughs

Hermetic conductive feedthroughs for a semiconductor wafer

US11485670B2 · filed 2019-11-04 · granted 2022-11-01 · Medtronic, Inc. notable

Why it ranks where it does

Glass-wafer feedthrough continuation.

Signals: 2-grant family chain · see methodology.

Inventors

David A. Ruben, Michael S. Sandlin

Same line

Read the full patent on Google Patents → (claims, figures, citations — all public domain)