Hermetic conductive feedthroughs for a semiconductor wafer

Abstract T1 · from the patent

A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough member has an inner face exposed along the internal surface for electrically coupling to a circuit, and extends partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.

Why it ranks where it does

Glass-wafer feedthrough (2013 filing).

Signals: founds its line · 2-grant family chain · see methodology.