The corpus · Hermetic Packaging & Feedthroughs

Sealed package including electronic device and power source

US12610487B2 · filed 2020-09-06 · granted 2026-04-21 · Medtronic, Inc. notable

Why it ranks where it does

2026 grant: sealed package with non-bonded (pressure-only) power connection; already 13 citing families.

Signals: see methodology.

Inventors

John K. Day, Michael J. Nidelkoff, Kris A. Peterson, Andrew J. Ries, David A. Ruben, Craig L. Wiklund

Read the full patent on Google Patents → (claims, figures, citations — all public domain)