The corpus · Hermetic Packaging & Feedthroughs
Sealed package including electronic device and power source
US12610487B2 · filed 2020-09-06 · granted 2026-04-21 · Medtronic, Inc. notable
Why it ranks where it does
2026 grant: sealed package with non-bonded (pressure-only) power connection; already 13 citing families.
Signals: see methodology.
Inventors
John K. Day, Michael J. Nidelkoff, Kris A. Peterson, Andrew J. Ries, David A. Ruben, Craig L. Wiklund
Read the full patent on Google Patents → (claims, figures, citations — all public domain)