The corpus · Hermetic Packaging & Feedthroughs

Hermetic wafer-to-wafer bonding with electrical interconnection

US8433402B2 · filed 2010-04-28 · granted 2013-04-30 · Medtronic, Inc.

Inventors

David A. Ruben, Michael F. Mattes, Jonathan R. Smith

Read the full patent on Google Patents → (claims, figures, citations — all public domain)