The corpus · Hermetic Packaging & Feedthroughs

Hermetic assembly and device including same

US11865639B2 · filed 2020-12-10 · granted 2024-01-09 · Medtronic, Inc. supporting

Why it ranks where it does

Hermetic-assembly earlier grant.

Signals: 2-grant family chain · see methodology.

Inventors

David A. Ruben, Andreas Fenner, Andrew J. Ries, Robert A. Munoz, Christopher T. Kinsey, Mark E. Henschel

Same line

Read the full patent on Google Patents → (claims, figures, citations — all public domain)