The corpus · Hermetic Packaging & Feedthroughs
Encapsulation circuitry on a substrate
US7682878B2 · filed 2007-10-23 · granted 2010-03-23 · Medtronic, Inc. notable
Why it ranks where it does
Encapsulation continuation.
Signals: first-listed inventor · 2-grant family chain · see methodology.
Inventors
David A. Ruben, Scott B. Sleeper, Peter C. Tortorici
Same line
- US7288847B2 — Assembly including a circuit and an encapsulation frame, and method of making the same (2007)
Read the full patent on Google Patents → (claims, figures, citations — all public domain)