The corpus · Hermetic Packaging & Feedthroughs
Assembly including a circuit and an encapsulation frame, and method of making the same
US7288847B2 · filed 2005-01-25 · granted 2007-10-30 · Medtronic, Inc. notable
Why it ranks where it does
First-listed encapsulation frame; 13 visible citations incl. Shindengen.
Signals: first-listed inventor · founds its line · 2-grant family chain · see methodology.
Inventors
David A. Ruben, Scott B. Sleeper, Peter C. Tortorici
Same line
- US7682878B2 — Encapsulation circuitry on a substrate (2010)
Read the full patent on Google Patents → (claims, figures, citations — all public domain)