Interconnects & Materials
The quiet cluster: corrosion-resistant contact stacks using titanium-niobium, metallization with deliberately tailored (even negative) thermal expansion so joints don't tear themselves apart across temperature swings, freeform substrates cut to the device's interior shape, and terminal arrays that replaced hand-wiring. Nearly all sole-inventor work — the personal toolbox underneath everything else. T3 · interpretation
5 granted patents in this theme
| Granted | Patent |
|---|---|
| 2004 | Freeform substrates and devices US6787891B2 · sole inventor |
| 2005 | Implantable medical device including a surface-mount terminal array US6963780B2 |
| 2008 | Freeform substrates and devices US7335530B2 · sole inventor |
| 2012 | Metallization with tailorable coefficient of thermal expansion US8141556B2 · sole inventor |
| 2013 | Layered structure for corrosion resistant interconnect contacts US8461681B2 · sole inventor |