Metallization with tailorable coefficient of thermal expansion

Abstract T1 · from the patent

An interconnect for an implantable medical device includes a pad and a first layer introduced over the pad. At least one of the pad or the first layer comprises a negative coefficient of thermal expansion (CTE) material.

Why it ranks where it does

Sole-inventor negative-CTE metallization (Nb/Nb2O5 with an explicit design equation); 4 of 5 visible citations are Lockheed Martin.

Signals: sole inventor · see methodology.