Layered structure for corrosion resistant interconnect contacts

Abstract T1 · from the patent

An interconnect for an implantable medical device includes a first conductive layer, a second conductive layer over the first, and a third conductive layer over the second. One of the layers comprises titanium-niobium (Ti-Nb).

Why it ranks where it does

Sole-inventor Ti-Nb corrosion-resistant contact stack.

Signals: sole inventor · see methodology.