Wafer-scale package including power source
US9318400B2 · filed 2014-02-21 · granted 2016-04-19 · Medtronic, Inc. flagship
Why it ranks where it does
Continuation of the wafer-scale power line; 151 citing families — the corpus max. Promoted on sweep data 2026-07-22.
Signals: 2-grant family chain · see methodology.
Inventors
Richard J. O'Brien, John K. Day, Paul F. Gerrish, Michael F. Mattes, David A. Ruben, Malcolm K. Grief
Same line
- US8666505B2 — Wafer-scale package including power source (2014)
Read the full patent on Google Patents → (claims, figures, citations — all public domain)