Wafer-scale package including power source

US8666505B2 · filed 2011-01-28 · granted 2014-03-04 · Medtronic, Inc. flagship

Why it ranks where it does

Wafer-scale package w/ internal power: 50 direct citations + 126 citing families — top-tier measured influence in the leadless-device era. Promoted on sweep data 2026-07-22.

Signals: founds its line · 2-grant family chain · see methodology.

Inventors

Richard J. O'Brien, John K. Day, Paul F. Gerrish, Michael F. Mattes, David A. Ruben, Malcolm K. Grief

Same line

US9318400B2 — Wafer-scale package including power source (2016)

Read the full patent on Google Patents → (claims, figures, citations — all public domain)