Devices Formed With Techniques for Bonding Substrates Using an Intermediate Layer

US9688053B2 · filed 2015-08-27 · granted 2017-06-27 · Medtronic, Inc., Minneapolis, MN (US)

Inventors

David A. Ruben, Michael S. Sandlin

Read the full patent on Google Patents → (claims, figures, citations — all public domain)