Techniques for bonding substrates using an intermediate layer

Abstract T1 · from the patent

A method includes depositing a thin film on a first surface of a first substrate and moving a second surface of a second substrate into contact with the thin film so the film is located between the surfaces. The method generates electromagnetic radiation of a first wavelength, selected such that the thin film absorbs radiation at that wavelength, and directs the radiation through one of the substrates onto a region of the thin film until the two substrates are fused in the region.

Why it ranks where it does

Thin-film intermediate-layer bonding.

Signals: founds its line · 2-grant family chain · see methodology.